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PC

What is PC (Polycarbonate)?

PC (Polycarbonate) is a high-performance thermoplastic engineering plastic produced by step-growth polymerization of bisphenol A (BPA) and phosgene. It appears transparent or translucent with outstanding toughness and extremely high impact resistance, along with excellent light transmittance and heat resistance. It can be repeatedly melted and remolded.

Leveraging its combined advantages of light weight, strength, transparency, and insulation, PC can be processed into complex irregular structures that are difficult to achieve with traditional methods. It is often used as a substitute for glass and some metal materials, widely applied in the production of functional components with high requirements for strength, heat resistance, and light transmission.

  • Bisphenol A + phosgene polymerization: The step-growth process gives PC a unique molecular chain structure that combines rigidity and toughness
  • Transparent/translucent appearance: High optical clarity with light transmittance exceeding 90%, capable of replacing glass for light-transmitting components
  • Re-meltable and remoldable: A thermoplastic material supporting recycling and reuse with high resource utilization
  • Lightweight metal alternative: Density is only 1/2 that of glass and 1/3 that of aluminum — ideal for lightweight design

Why PC for 3D Printing?

01Outstanding mechanical properties

Impact resistance far exceeds conventional filaments with ample toughness — does not shatter under impact or external compression, suitable for protective and high-load functional parts

02Excellent environmental tolerance

Outstanding heat resistance while tolerating grease and most common solvents, adaptable to complex working conditions

03Reliable electrical insulation

Good insulating capability makes it an ideal material for electronic and electrical accessories

04High forming freedom

Leveraging 3D printing technology, it can produce workpieces with internal flow channels, lattice structures, and complex internal cavities — supporting small-batch customization and rapid product iteration

05Practical attributes

Overall lightweight material with lower weight than metal components, and the material itself supports recycling and reuse

Pros and Cons of PC

Pros

Top-Tier Impact Resistance

Excellent toughness — does not crack or shatter under impact or repeated stress; the first choice for protective components

Outstanding Light Transmission

High optical clarity for creating transparent parts, lenses, and protective panels

Strong Heat Stability

Maintains structural integrity and dimensional stability in high-temperature environments

Good Chemical Resistance

Good tolerance to grease and most industrial solvents

Excellent Electrical Insulation

Suitable for insulating accessories in various electronic and electrical equipment

Superior Dimensional Stability

Minimal deformation under temperature fluctuations, ensuring finished part accuracy

Recyclable

A recyclable thermoplastic material with high resource utilization

Cons

Feature Description Impact
Poor scratch resistance Surface is highly susceptible to scratches that directly compromise light transmittance and appearance Additional scratch-resistant coating usually required
Significant moisture absorption Absorbs moisture from air easily; affects print quality when damp Strict drying required before storage and printing
High equipment requirements High melting point requiring 290-300°C extrusion temperature; stringent heated bed and chamber temperature control Not compatible with entry-level printers
Prone to warping, poor adhesion High thermal shrinkage rate; severe warping occurs with improper temperature control; first layer struggles to adhere to print bed Must be used with enclosed chamber
Higher cost Raw material and finished filament prices exceed most filaments including PLA, ABS, and PA Mainly used in mid-to-high-end applications
Not biodegradable Difficult to decompose in natural environments; discarded material can cause plastic pollution Proper recycling and disposal required
Note The drawbacks of PC are primarily related to printing conditions and surface treatment. Its impact resistance and optical transparency rank at the top among all base materials, making it an irreplaceable choice for safety protective parts and optical components.

PC-Derived Materials by eSUN

PC-ESD (Anti-Static PC, New Product)

Provides stable and excellent anti-static performance on top of high strength and heat resistance, suitable for engineering-grade components used in high-temperature working conditions and long-term applications. Currently the most comprehensively performant option available.

PC-HT (High-Temperature PC)

A high-temperature polycarbonate specifically designed for higher temperature environments, with a heat deflection temperature of up to 113.6°C (per PC-HT TDS), meeting more demanding heat resistance requirements.

PC-FR (Halogen-Free Flame-Retardant PC, In Development)

eSUN is developing halogen-free flame-retardant PC material that maintains PC's high impact resistance and high light transmittance advantages while achieving safe and environmentally friendly flame retardancy, meeting the strict fire safety requirements of the electronics and electrical industries.

R&D Direction Halogen-free flame-retardant PC development — safe and environmentally friendly. eSUN is committed to developing PC materials that combine high performance with environmental characteristics, providing safer and more reliable material solutions for the electronics, electrical, and aerospace industries.
Tip PC-FR is currently in the R&D phase. Please follow eSUN's official channels for availability updates.

Industry Applications

Industry Typical Applications
Automotive Automotive headlight lenses, vehicle transparent accessories, interior functional structural parts, small body protective components
Electronics & Electrical Electrical housings, lighting transparent accessories, insulating components, equipment transparent protective covers
Safety & PPE Protective goggles, safety face shields, protective helmets, and various safety protective products
Aerospace Lightweight structural parts, airborne equipment protective housings, aviation transparent windows
Outdoor & Consumer Goods Sports helmets, carabiners, eyeglass frames, transparent decorative parts

Base Material Comparison

Compared with: PETG, ABS

Dimension PC PETG ABS
Impact Resistance Top-tier; does not shatter under strong impact; strongest protective performance Good, but inferior to PC Moderate; more brittle than PC
Light Transmission Top-tier optical clarity; capable of replacing glass Semi-transparent; moderate light transmittance Opaque
Heat Resistance Heat deflection temperature 80°C (PC-HT up to 113.6°C) Heat deflection temperature 64°C Heat deflection temperature 78°C
Print Difficulty Extremely high (290-300°C extrusion + enclosed chamber) Low (easy to print, beginner-friendly) High (enclosed chamber + high-temp heated bed required)
Cost High Low Moderate
Key Advantages Summary
  • Impact Resistance Champion: Top-tier impact resistance among all base materials — does not shatter under impact; the first choice for safety protective components
  • Top-Tier Optical Clarity: Simultaneously possesses top-tier optical transparency, capable of replacing glass for light-transmitting components
  • Leading Heat Resistance: Heat resistance temperature exceeds most general-purpose engineering plastics; PC-HT version reaches 113.6°C
  • Unique Positioning: Safety protective parts, optical lenses, transparent windows, high-impact load parts, aerospace/electronics high-end structural components

PC Printing Tips

Warning: Pre-Drying Required PC is significantly moisture-sensitive. Before printing, dry the filament at 70°C for more than 6 hours to improve print quality. It is recommended to use the eSUN eBOX filament box to prevent re-absorption of moisture during printing.
Warning: Enclosed Chamber Printing PC has a relatively high shrinkage rate. Maintain temperature during printing by using an enclosed chamber printer to prevent warping and interlayer cracking.
Warning: High-Temperature Equipment Required PC has an extremely high melting point requiring 290-300°C extrusion temperature, along with stringent heated bed and chamber temperature control. Entry-level printers are not compatible. Ensure your printer supports high-temperature extrusion and enclosed chamber printing.
Parameter Recommended Notes
Drying Temperature / Time 70°C / >6h Strict pre-drying required before printing
Extrusion Temperature 290 - 300°C High-temperature extrusion equipment required
Heated Bed Temperature 100 - 110°C High-temp bed used with adhesive
Chamber Temperature Enclosed & insulated Enclosed chamber printer required
Cooling Fan Off or very low Avoid interlayer cracking
Print Speed 20 - 50 mm/s Slower speeds recommended for quality
Dry Storage Sealed dry storage Recommended to use with eBOX filament box